Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
- Robert Bruce
- Sebastian Engelmann
- et al.
- 2013
- Journal of Physics D: Applied Physics
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62 results for S. Purushothaman
Post Porosity Plasma Protection applied to a wide range of ultra low-k materials
- Theo Frot
- Willi Volksen
- et al.
- 2012
- IITC 2012
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
Integration of a manufacturing grade, k = 2.0 spin-on material in a single damascene structure
- Willi Volksen
- Sampath Purushothaman
- et al.
- 2012
- ECS J. Solid State Sci. Technol.
Post Porosity Plasma Protection a new approach to integrate k 2.2 porous ULK materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- IITC/MAM 2011
A Manufacturing grade, porous oxycarbosilane spin-on dielectric candidate with K 2.0
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2011
- JES
Extending photo-patternable low-κ concept to 193 nm lithography and e-beam lithography
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2011
- SPIE Advanced Lithography 2011
Application of the protection/deprotection strategy to the science of porous materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- Advanced Materials
Patternable low-κ material for "greener" semiconductor manufacturing
- Qinghuang Lin
- Shyng-Tsong Chen
- et al.
- 2010
- ICSICT 2010
Multi-level integration of patternable low-κ material into advanced Cu BEOL
- Qinghuang Lin
- Shyng-Tsong Chen
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010