A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
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62 results for S. Purushothaman
Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
- K.W. Guarini
- A. Topol
- et al.
- 2002
- IEDM 2002
Development of low cost, low temperature conductive adhesives
- S.K. Kang
- S. Purushothaman
- 1998
- ECTC 1998
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Interfacial reactions with lead (Pb)-free solders
- R.S. Rai
- S.K. Kang
- et al.
- 1995
- ECTC 1995
Application of the protection/deprotection strategy to the science of porous materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- Advanced Materials
Atomic-beam alignment of inorganic materials for liquid-crystal displays
- P. Chaudhari
- James Lacey
- et al.
- 2001
- Nature
Low-voltage, high-mobility pentacene transistors with solution-processed high dielectric constant insulators
- Christos D. Dimitrakopoulos
- Ioannis Kymissis
- et al.
- 1999
- Advanced Materials
Low-voltage organic transistors on plastic comprising high-dielectric constant gate insulators
- C. Dimitrakopoulos
- S. Purushothaman
- et al.
- 1999
- Science