W.E. Bron, R.W. Dreyfus
Physical Review Letters
Bulk copper is laser etched with 193- and 351-nm excimer radiation. The transition from the thermal to the plasma etch region is studied by measuring the densities and kinetic energies of three copper species (Cu0, Cu+, and Cu2) in the etch plume. A unique laser-induced fluorescence experiment allows these three species to be followed essentially simultaneously as a function of fluence. Three separate types of etching behavior are clearly evident (even within the small fluence range of ∼1-12.5 J/cm2); i.e., thermal vaporization of Cu, multiphoton ionization of the Cu vapor, and electron-atom collision-induced ionization (breakdown) and dissociation (of Cu2).
W.E. Bron, R.W. Dreyfus
Physical Review Letters
R.E. Walkup, R.W. Dreyfus, et al.
Colloque International du CNRS 1982
R.W. Dreyfus
Applied Optics
Roger Kelly, R.W. Dreyfus
Nuclear Inst. and Methods in Physics Research, B