Daniel J. Coady, Amanda C. Engler, et al.
ACS Macro Letters
The use of a dedicated chamber to perform pre-epi deposition cleaning allows native oxide removal with a low thermal budget, and significantly improves throughput of low-temperature Si and SiGe applications. Wafers processed in the cleaning chamber show no detectable contaminants, and the cleansed surface is actually significantly smoother because of cleaning down to a sub-angstrom level.
Daniel J. Coady, Amanda C. Engler, et al.
ACS Macro Letters
J.K. Gimzewski, T.A. Jung, et al.
Surface Science
Lawrence Suchow, Norman R. Stemple
JES
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999