Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project

In this paper, we present early results of wetting behavior of the Low Temperature solder materials with Cu surface and compare it to conventional Tin (Sn)-Silver (Ag)-Copper (Cu) solder materials experimentally. Using this experimental wetting angle data, we present the simulation results of First Level Interconnect (FLI) joint formation using a collapse model. The results are critical to characterizing the relationship between dynamic collapse during solder joint formation and the effect of solder wetting angles. This understanding will be critical in future to study the solder joint yield and reliability for low temperature solder systems for FLI.