Publications

4 results for Russell Kastberg

Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect
- - Toyohiro Aoki
  - Yasuharu Yamada
  - et al.
- 2025
- ICEP-IAAC 2025
Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project
- - Shripad Gokhale
  - Edvin Cetegen
  - et al.
- 2025
- ICEP-IAAC 2025
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023