PaperIon beam patterning of block copolymer thin filmsRanulfo Allen, John Baglin, et al.J. Photopolym. Sci. Tech.
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperElectron and positron channeling radiation from beryllium oxideH.D. Dulman, R.H. Pantell, et al.Physical Review B
