Isabel De Sousa, Donald W. Henderson, et al.
ECTC 2006
Paper
Effect of polyimide processing on multichip glass ceramic module fabrications
Abstract
Contaminants introduced during polyimide (PI) processing cause open and short circuit defects of multichip glass ceramic modules (MCM-D). Fibers, metal flakes, particles and polishing scratches expose the PI to the hot N-methylpyrollidinone (NMP) solvent which diffuses to the polyimide/copper wiring structures causing them to swell. The amount of damage depends on the rate of solvent diffusion, process temperature, lift-off time and the amount of PI swelling during processing.
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