Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
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67 results for D.Y. Shih
Comparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
Effect of Zn doping on SnAg solder microstructure and electromigration stability
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Journal of Applied Physics
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Microelectronics Reliability
Blech effect in Pb-free flip chip solder joint
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Applied Physics Letters
C4NP technology: Present and future
- Eric Perfecto
- Da-Yuan Shih
- et al.
- 2008
- GBC 2008