Bing Dang, Muhannad S. Bakir, et al.
JMEMS
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system. © 2007 IEEE.
Bing Dang, Muhannad S. Bakir, et al.
JMEMS
Bing Dang, Da-Yuan Shih, et al.
ECTC 2008
Steven L. Wright, Paul S. Andry, et al.
ECTC 2008
Deepak Sekar, Calvin King, et al.
IITC 2008