TalkDirect electrical access to the spin manifolds of individual lanthanide atomsGregory Czap, Kyungju Noh, et al.APS Global Physics Summit 2025
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperKinetic model for the chemical vapor deposition of tungsten in the silane reduction processJulian J. HsiehJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
