K.N. Tu
Materials Science and Engineering: A
This letter describes a novel equivalent circuit model extraction approach for flip-chip ball interconnects based on a direct probing techniques. The derived model has been verified up to 40 GHz. © 2005 IEEE.
K.N. Tu
Materials Science and Engineering: A
F.J. Himpsel, T.A. Jung, et al.
Surface Review and Letters
E. Burstein
Ferroelectrics
A. Ney, R. Rajaram, et al.
Journal of Magnetism and Magnetic Materials