250 Gbps 10-channel WDM silicon photonics receiver
Huapu Pan, Solomon Assefa, et al.
GFP 2012
A scalable and tolerant optical interfacing method based on flipchip bonding is developed for silicon photonics packaging. Bidirectional optical couplers between multiple silicon-on-insulator waveguides and single-mode polymer waveguides are designed and fabricated. Successful operation is verified experimentally in the 1530-1570 nm spectral window. At the wavelength of 1570 nm, the coupling loss is as low as 0.8 dB for both polarization states and the planar misalignment loss is less than 0.6 dB for TE and 0.3 dB for TM polarization in a lateral silicon-polymer waveguide offset range of ± 2 μm. The coupling loss does not exhibit any temperature dependence up to the highest measurement point of 70°C. © 2013 Optical Society of America.
Huapu Pan, Solomon Assefa, et al.
GFP 2012
P. Chris Broekema, Albert-Jan Boonstra, et al.
HPDC 2012
Jens Hofrichter, Antonio La Porta, et al.
OI 2012
Jing Yang, Tobias Lamprecht, et al.
CLEOPR 2011