Flip-chip, self-aligned, optoelectronic transceiver module

K. Jackson; E.B. Flint; M.F. Cina; D. Lacey; J.M. Trewhella; P. Buchmann; C. Harder; P. Vettiger

doi:10.1109/LEOSST.1992.697470

IEE/LEOS Summer Topical Meetings 1992

Conference paper

29 Jul 1992

Flip-chip, self-aligned, optoelectronic transceiver module

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Abstract

A compact, planar-processed optoelectronic transceiver package is described for monolithic arrays of self-aligned, flip-chip mounted OEICs coupled to arrays of multimode optical waveguides and fibers.

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Improvements in Index alignment method for laser-fiber array packaging

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