Thermal-mechanical analysis of terabus high-speed optoelectronic package
- Shashikant Hegde
- Lei Shan
- et al.
- 2005
- ECTC 2005
Publications
Date
Featured collections
Popular topics
27 results for Jean M. Trewhella
Thermal impedance measurements of junction-down mounted single-side contact laser diodes
- Guy Cohen
- Lei Shan
- et al.
- 2004
- ECTC 2004
Model-to-hardware correlations in the design of a 50Gb/s package
- Lei Shan
- Mounir Meghelli
- et al.
- 2003
- ECTC 2003
Performance comparison of small form factor fiber optic connectors
- J.M. Trewhella
- Casimer DeCusatis
- et al.
- 1999
- ECTC 1999
Packaging aspects of the Jitney parallel optical interconnect
- M.S. Cohen
- Glen W. Johnson
- et al.
- 1998
- ECTC 1998
Comparison of low-cost fiber optic technologies for data transmission
- M.B. Ritter
- J.M. Trewhella
- et al.
- 1997
- ECTC 1997
Jitney parallel optical interconnect
- J.D. Crow
- Joong-ho Choi
- et al.
- 1996
- ECTC 1996
Unibody plastic injection-molded optical sub-assembly for large core fiber
- J.M. Trewhella
- M.M. Oprysko
- et al.
- 1996
- ECTC 1996
Design, analysis and experimental verification of an equalized 10Gbps link
- Lei Shan
- Young Kwark
- et al.
- 2006
- DesignCon 2006
Chip-to-chip optical interconnects
- J.A. Kash
- F.E. Doany
- et al.
- 2006
- OFC/NFOEC 2006