Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
The preparation of evaporated thin films of largely single-crystalline copper on mica substrates is reported. Most of the exposed copper surface has (111) orientation, as established by grazing incidence x-ray scattering and electrochemical studies. The (111) surface domains are on the order of 300 A in diameter and have a mosaic spread of ca. 0.1°. Underpotential deposition (UPD) shifts for Pb and T1 on these Cu(lll) films are approximately 150 and 300 mV, respectively. T1 is shown to form a UPD bilayer on this substrate. These epitaxial Cu films can be utilized in electrochemical surface/ interface studies. © 1991, The Electrochemical Society, Inc. All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Thomas H. Baum, Carl E. Larson, et al.
Journal of Organometallic Chemistry
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials
H.D. Dulman, R.H. Pantell, et al.
Physical Review B