HIGH TEMPERATURE POLYMERS FOR ELECTRONIC DEVICES.

Abstract

In this paper, the potential advantages of polymers as dielectric insulating layers in advanced microelectronic devices are described along with the requirements for their use in chips. Some of the key results obtained from a detailed study of polyimides carried out are summarized along with efforts aimed at optimizing the polyamic acid precursor to achieve improved processibility. Finally, some preliminary results of work on a new type of high temperature polymer are described that appears to satisfy many of the shortcomings of existing systems.