High throughput lithography using thermal scanning probes

Abstract

Thermal scanning probe lithography (t-SPL) has demonstrated unique capabilities for maskless lithography. A heated atomic force microscope tip is used to locally remove a thermally sensitive resist. This process is able to fabricate precise 3D patterns and high resolution structures without the use of charged particles, such as electrons, which have been implicated in substrate damage. Here we outline our work to improve the throughput of t-SPL via integration with a laser writer for the patterning of large features and the development of independently addressable cantilever arrays.