Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
We review some opto-electronic devices based on the III-V/SOI heterogeneous integration platform, including lasers, modulators, wavelength converters, and photo-detectors. All of them are critical components for future on-chip interconnect and optical network-on-chip. The footprints of such devices are kept small by employing micro-cavity based structures. We give an overview of the device performances. The advantages over the all-silicon based devices are also discussed. Copyright © 2010 American Scientific Publishers All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
K.N. Tu
Materials Science and Engineering: A
Thomas H. Baum, Carl E. Larson, et al.
Journal of Organometallic Chemistry
J.H. Kaufman, Owen R. Melroy, et al.
Synthetic Metals