Implantation damage and the anomalous transient diffusion of ion-implanted boron

Abstract

The effect of the implantation of silicon ions on the anomalous transient diffusion of ion-implanted boron is investigated. It is found that silicon ion fluences well below that necessary to amorphize the lattice substantially reduce the anomalous transient diffusion of subsequently implanted boron. The sheet resistance, however, is increased by the additional silicon implant. The implantation of silicon ions into activated boron layers causes additional anomalous diffusion at substantial distances beyond the range of the silicon ions. The anomalous motion is also reduced in regions where the damage is greater. The effects can be explained in terms of the generation of point defect clusters which dissolve during anneal and the sinking of point defects in the regions of high damage by the formation of interstitial type extended defects.