Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Rough silicon surfaces resulting from CF4 reactive ion etching have been studied by scanning electron microscopy/scanning Auger microscopy and x‐ray photoemission spectroscopy. The experimental data demonstrate a roughening mechanism based on laterally non‐uniform etch rates due to the existence of involatile surface residues. Copyright © 1986 John Wiley & Sons Ltd.