OE device integration for optically enabled MCM

Abstract

We propose a new architecture of optical device integration on SLC carrier with capability of handling of the optical signals directly on MCM, or an optically enabled MCM, where VCSELs/PDs and the interface chips are placed closer to the main VLSI on a waveguide integrated SLC, while the optical connectors are at the periphery of the SLC carrier. This separated structure allows the highest number of optical channels per periphery length defined by the connector size, as well as the higher optical speed. © 2007 IEEE.