Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John U. Knickerbocker
- Jean Benoit Herou
- et al.
- 2025
- ECTC 2025
Publications
68 results for Yoichi Taira
Photonic Modules with High Density Polymer Waveguide Interface
- J.B. Heroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Photonic Modules with High Density Polymer Waveguide Interface
- J.B. Héroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Advances in Interfacing Optical Fibers to Nanophotonic Waveguides Via Mechanically Compliant Polymer Waveguides
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2020
- IEEE JSTQE
Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2019
- SPIE OPTO 2019
Compliant Polymer Interface Demonstration with Standard Plug-In Connection to Fiber Cables
- Tymon Barwicz
- Kengo Watanabe
- et al.
- 2018
- IPC 2018
Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- ECTC 2018
Automated, high-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2018
- Optical Fiber Technology
Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- SPIE OPTO 2018
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017