Eren Kursun, Jamil Wakil, et al.
ACM JETC
Paper
Opportunities and challenges for 3D systems and their design
Abstract
Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.
Related
Yibo Chen, Eren Kursun, et al.
IEEE TCADIS
Conference paper
Power and thermal characterization of POWER6 system
Victor Jiménez, Francisco J. Cazorla, et al.
PACT 2010
Chen-Yong Cher, Eren Kursun
Transactions on Architecture and Code Optimization