Conference paper
3D stacking of high-performance processors
Philip Emma, Alper Buyuktosunoglu, et al.
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Paper
Opportunities and challenges for 3D systems and their design
Abstract
Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.
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