Investigations of silicon nano-crystal floating gate memories
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000
The out-of-plane thermal expansion coefficient α⊥ of biphenyldianhydride-phenylenediamine (BPDA-PDA) polyimide thin film between 20 and 400°C has been measured using a laser spot scanning interferometer. The α⊥ varies from 100 ppm/°C at 20°C to 400 ppm/°C at 400°C. As the result of highly anisotropic microstructure, the α⊥ is much larger than the in-plane thermal expansion coefficient α∥ and increases dramatically when the temperature exceeds the glass transition temperature (≈320°C). © 1993 The Minerals, Metals & Materials Society.
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000
J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
B.A. Hutchins, T.N. Rhodin, et al.
Surface Science