R. Ghez, J.S. Lew
Journal of Crystal Growth
The out-of-plane thermal expansion coefficient α⊥ of biphenyldianhydride-phenylenediamine (BPDA-PDA) polyimide thin film between 20 and 400°C has been measured using a laser spot scanning interferometer. The α⊥ varies from 100 ppm/°C at 20°C to 400 ppm/°C at 400°C. As the result of highly anisotropic microstructure, the α⊥ is much larger than the in-plane thermal expansion coefficient α∥ and increases dramatically when the temperature exceeds the glass transition temperature (≈320°C). © 1993 The Minerals, Metals & Materials Society.
R. Ghez, J.S. Lew
Journal of Crystal Growth
T.N. Morgan
Semiconductor Science and Technology
P. Alnot, D.J. Auerbach, et al.
Surface Science
A. Ney, R. Rajaram, et al.
Journal of Magnetism and Magnetic Materials