Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
The mechanism involved in the initiation of electroless copper deposition onto dielectric substrates using Pd+2/ poly(acrylic acid) thin films is described. Dielectric substrates are catalyzed by dip-coating in aqueous poly(acrylic acid) to deposit a 50–300 nm thick film of the polymer on the surface; the coated substrate is then immersed in aqueous PdS04. It is shown that uptake of palladium in the poly(acrylic acid) film occurs by H+/Pd+2 ion exchange. The active catalyst is identified by x-ray photoelectron spectroscopy as zerovalent palladium, formed when the Pd+2-exchanged polymer film is immersed in an electroless copper deposition bath. © 1990, The Electrochemical Society, Inc. All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
Sung Ho Kim, Oun-Ho Park, et al.
Small
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films