Modeling polarization for Hyper-NA lithography tools and masks
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
The process of locating components in an available space while satisfying spatial relationships among the components is called packaging. The task requires extensive spatial reasoning about geometric shapes. It is a generic design task common to many domains. It is also very time-consuming, especially as machines become more compact and complex. This paper describes progress toward automation of the packaging problem. An approach is proposed to determine the optimal locations of components in an assembly from spatial relationships between the components. The approach utilizes a novel combination of optimization and solid modeling techniques. © 1991 ASME.
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Michael C. McCord, Violetta Cavalli-Sforza
ACL 2007
Robert C. Durbeck
IEEE TACON
Rajiv Ramaswami, Kumar N. Sivarajan
IEEE/ACM Transactions on Networking