C. Engström, J. Birch, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
The minimum epitaxial layer thickness required to produce relaxed, thermally stable, Si0.7Ge0.3 buffer layer structures for high electron- and hole-mobility devices has been determined, using high resolution x-ray diffraction. A 1.4-μm-thick layer, step graded to x=0.35, is sufficiently thick so that the residual strain in a uniform composition Si 0.33Ge0.67 layer grown on top of it is essentially independent of thickness or growth temperature of the layer. Such structures are stable when annealed at 750°C.© 1995 American Institute of Physics.
C. Engström, J. Birch, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
K. Ismail
Physica B: Condensed Matter
Srijit Goswami, K.A. Slinker, et al.
Nature Physics
S. Rishton, K. Ismail, et al.
Microelectronic Engineering