E. Gusev, D.A. Buchanan, et al.
Microelectronic Engineering
The selective thermal decomposition of silica from a silicate/silicon (001) interface without silicidation of the dielectric was reported. The electrical characteristics of silicate/silicon interfaces were studied. The intriguing consequence of the relative stability of metal-oxide compounds was discussed. It was shown that after initial silicate formation excess of interfacial silica is decomposed.
E. Gusev, D.A. Buchanan, et al.
Microelectronic Engineering
M. Horn-Von Hoegen, J. Falta, et al.
Applied Physics Letters
E. Cartier, V. Narayanan, et al.
VLSI Technology 2004
M. Copel, R.M. Tromp, et al.
Physical Review B