P. Alnot, D.J. Auerbach, et al.
Surface Science
The initial stage of the thermal oxidation of various crystallographic orientations of silicon ((100), (110), and (111) orientations) reveals a complex rate behavior. This behavior is not understood within the conventional linear-parabolic model. A recently revised model which explicitly contains the areal density of Si atoms and mechanical stress effects is shown to provide both a qualitative (for all orientations studied) and somewhat quantitative (for (110) and (111) orientations) explanation of the complex substrate orientation effects. © 1986, The Electrochemical Society, Inc. All rights reserved.
P. Alnot, D.J. Auerbach, et al.
Surface Science
Oliver Schilter, Alain Vaucher, et al.
Digital Discovery
K.N. Tu
Materials Science and Engineering: A
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999