Michiel Sprik
Journal of Physics Condensed Matter
The initial stage of the thermal oxidation of various crystallographic orientations of silicon ((100), (110), and (111) orientations) reveals a complex rate behavior. This behavior is not understood within the conventional linear-parabolic model. A recently revised model which explicitly contains the areal density of Si atoms and mechanical stress effects is shown to provide both a qualitative (for all orientations studied) and somewhat quantitative (for (110) and (111) orientations) explanation of the complex substrate orientation effects. © 1986, The Electrochemical Society, Inc. All rights reserved.
Michiel Sprik
Journal of Physics Condensed Matter
A. Gangulee, F.M. D'Heurle
Thin Solid Films
Andreas C. Cangellaris, Karen M. Coperich, et al.
EMC 2001
R. Ghez, J.S. Lew
Journal of Crystal Growth