Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
We discuss the advances of several optical interconnect options, including the VCSEL based, the Si-photonics based, and the monolithically integrated approaches. In addition, we discuss the possibility of using optical method to power and connect smartdust type of devices.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Yves Martin, Swetha Kamlapurkar, et al.
ECTC 2017
Joris Van Campenhout, William M. J. Green, et al.
CLEO 2010
Jeffrey B. Driscoll, William Astar, et al.
IEEE Journal on Selected Topics in Quantum Electronics