Flip-chip III-V-to-silicon photonics interfaces for optical sensor
- Yves Martin
- Jason S. Orcutt
- et al.
- 2019
- ECTC 2019
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100 results for Tymon Barwicz
Novel solder pads for self-aligned flip-chip assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2019
- ECTC 2019
Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- ECTC 2018
Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2017
- ECTC 2017
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- Yves Martin
- Jae Woong Nah
- et al.
- 2016
- ECTC 2016
Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2016
- ECTC 2016
Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2015
- ECTC 2015
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2015
- ECTC 2015
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
- Jae Woong Nah
- Yves Martin
- et al.
- 2015
- ECTC 2015