Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperAutomated search method for AFM and profilersMichael Ray, Yves C. MartinProceedings of SPIE - The International Society for Optical Engineering
Conference paperInterface state generation in pFETs with ultra-thin oxide and oxynitride on (100) and (110) Si substratesJ.H. Stathis, R. Bolam, et al.INFOS 2005
PaperStructural and magnetic properties of Cr and Mn doped InNA. Ney, R. Rajaram, et al.Journal of Magnetism and Magnetic Materials
