Conference paper
LPCVD TUNGSTEN SILICIDE WITH TITANIUM UNDERLAYER.
R.V. Joshi, L. Krusin-Elbaum, et al.
VLSI Technology 1985
Films of WSi2 initially deposited in an amorphous form have been known to display an unexpected resistivity maximum when annealed at a temperature corresponding to the transition from the low-temperature hexagonal structure to the high-temperature tetragonal structure. It is shown that the resistivity maximum is due to an extremely high (5×106/cm) density of stacking faults. Thus, at least one of the scattering defects which contribute to the relatively high resistivity of WSi2 films has been identified.
R.V. Joshi, L. Krusin-Elbaum, et al.
VLSI Technology 1985
F.M. d'Heurle, R. Ghez
Thin Solid Films
O. Thomas, G. Scilla, et al.
Applied Surface Science
E.J. Van Loenen, J.F. Van Der Veen, et al.
Surface Science