Publication
IEEE Topical Meeting EPEPS 1997
Conference paper

Survey of model reduction techniques for analysis of package and interconnect models of high-speed designs

Abstract

An overview of the recent advances in model reduction techniques of linear interconnect and packaging models for the purpose of simulation is given. The importance of different methods for accuracy, stability, and generality are highlighted.

Date

Publication

IEEE Topical Meeting EPEPS 1997

Authors

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