Conference paper
ICCAD-2013 CAD contest in mask optimization and benchmark suite
Shayak Banerjee, Zhuo Li, et al.
ICCAD 2013
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Shayak Banerjee, Zhuo Li, et al.
ICCAD 2013
Aida Todri, Malgorzata Marek-Sadowska, et al.
ICCAD 2008
Joseph N. Kozhya, Sani R. Nassif, et al.
ICECS 2001
Sani R. Nassif, Zhuo Li
ISQED 2005