Emrah Acar, Kanak Agarwal, et al.
ISCAS 2006
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Emrah Acar, Kanak Agarwal, et al.
ISCAS 2006
Rouwaida Kanj, Zhuo Li, et al.
IEEE Trans Semicond Manuf
Joseph N. Kozhya, Sani R. Nassif, et al.
ICECS 2001
Iris Hui Ru Jiang, Gi Joon Nam, et al.
ICCAD 2014