Compression for data archiving and backup revisited
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
The microstructures of Hf/Al(Cu) and Ti/Al(Cu) bilayers have been investigated using transmission electron microscopy. Both flat-on and cross-sectional techniques were used to study the effects of annealing and Cu addition on the grain structure and interfacial morphology. While the Al-Hf system exhibits irregular morphology with spike formation, which becomes smoother with Cu addition, the Al-Ti system has significantly smoother morphology with or without Cu addition. © 1987, The Electrochemical Society, Inc. All rights reserved.
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
P.C. Pattnaik, D.M. Newns
Physical Review B
R.W. Gammon, E. Courtens, et al.
Physical Review B
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting