PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperESR and optical absorption of bound-small polarons in YAlO3O.F. Schirmer, K.W. Blazey, et al.Physical Review B
PaperAnomalous large grains in alloyed aluminum thin films I. Secondary grain growth in aluminum-copper filmsA. Gangulee, F.M. D'HeurleThin Solid Films