Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Paper
Thermal dry process soldering
Abstract
The use of nonflammable and nontoxic gases CF4, CF2C12, and SF6 for the reflow and bonding of Pb/Sn solder has been demonstrated. It has been found that a concentration of these gases on the order of l%~5% in a 760 Torr atmosphere of nitrogen or argon is sufficient for soldering. © 1986, American Vacuum Society. All rights reserved.
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