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SPIE Advanced Lithography 2008
The use of nonflammable and nontoxic gases CF4, CF2C12, and SF6 for the reflow and bonding of Pb/Sn solder has been demonstrated. It has been found that a concentration of these gases on the order of l%~5% in a 760 Torr atmosphere of nitrogen or argon is sufficient for soldering. © 1986, American Vacuum Society. All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
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Semiconductor Science and Technology
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MRS Spring Meeting 1993
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Chemistry of Materials