Sai Zeng, Angran Xiao, et al.
CAD Computer Aided Design
If the rate of improvement in the performance of advanced silicon integrated circuits is to be sustained, new techniques far the measurement of electrical waveforms in operating circuits are needed. Critical factors dictating this requirement include the increased speed and complexity of circuits, the growing importance of faults that appear only during high-speed operation, and the use of flip-chip packaging technologies. Two recently developed all-optical methods for measuring the switching activity from the backside of a chip are described and compared. One is a passive approach based on the measurement of hot carrier luminescence emitted from the channel of a CMOS field-effect transistor (FET) during switching. The second uses a laser probe to sense the switching induced modulation of the silicon optical constants near an FET's source and drain. © 2000 IEEE.
Sai Zeng, Angran Xiao, et al.
CAD Computer Aided Design
Leo Liberti, James Ostrowski
Journal of Global Optimization
Apostol Natsev, Alexander Haubold, et al.
MMSP 2007
Elena Cabrio, Philipp Cimiano, et al.
CLEF 2013