Topology Optimization for Embedded Cooling of Multiple and Transient Workloads in 3D Semiconductor Packages

A topology optimization framework is developed to design of embedded microchannel heat sinks that considers multiple workloads and transient thermal management challenges in 3D-stacked semiconductor packages. The framework integrates steady-state optimization with penalties in the design objective that update based on transient performance evaluations to iteratively adjust porosity distributions. The optimization begins with multi-workload steady-state analysis to ensure reliable thermal and hydraulic performance across all power distributions. These designs are modified by imposing localized penalties based on peak temperatures observed during dynamic loads, thus ensuring effective cooling under both continuous and transient conditions. Case studies show that the optimized designs reduce pressure drop and maintain target temperatures while balancing thermal and hydraulic constraints. This approach provides an efficient and scalable framework for the design of embedded cooling solutions for next-generation semiconductor packages.