Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping

Toyohiro Aoki, Kazushige Toriyama, et al.

IMAPS 2014

Paper

Development and commercialization of solder bump fabrication technology with molten solder injection method

Toyohiro Aoki, Kazushige Toriyama, et al.

J. Jpn. Inst. Electron. Packag.

Conference paper

Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

Toyohiro Aoki, Takashi Hisada, et al.

ICEP 2016

Conference paper

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, et al.

ECTC 2022

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