Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology

Eiji Nakamura, Toyohiro Aoki, et al.

Advancing Microelectronics

Conference paper

Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

Takashi Hisada, Sayuri Kohara, et al.

ICEP 2022

Paper

Development and commercialization of solder bump fabrication technology with molten solder injection method

Toyohiro Aoki, Kazushige Toriyama, et al.

J. Jpn. Inst. Electron. Packag.

Conference paper

Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Keiji Matsumoto, Takahito Watanabe, et al.

ECTC 2022

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