Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

Conference paper

Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

Toyohiro Aoki, Takashi Hisada, et al.

ICEP 2016

Conference paper

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, et al.

ECTC 2010

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Characterization of micro bump formed by Injection Molded Solder (IMS) technology

Toyohiro Aoki, Kazushige Toriyama, et al.

ICEP 2014

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