Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
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12 results for R.P. McGouey
Silylation of (photo)resist materials using polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1989
- ACS National Meeting 1989
Chemical and physical aspects of multilayer resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1989
- Proceedings of SPIE 1989
Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures
- R.A. Haring
- Sharon L. Nunes
- et al.
- 1995
- Journal of Materials Research
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Comparison of vapor and liquid phase silylation processes of photoresists
- E. Babich
- J. Paraszczak
- et al.
- 1991
- Microelectronic Engineering
RBS analysis of Si diffusion in photoresist during silylation
- P.B. Madakson
- S. Nunes
- et al.
- 1990
- Nuclear Inst. and Methods in Physics Research, B
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
- D.Y. Shih
- J. Cataldo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Silylation of resist materials using di- and polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1990
- Microelectronic Engineering
A study of the chemical and physical interaction between copper and polyimide
- D.Y. Shih
- J. Paraszczak
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films