Electromigration and reliability in submicron metallization and multilevel interconnection
- Thomas Kwok
- 1993
- Materials Chemistry and Physics
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39 results for Thomas Kwok
Thermal structural disorder and melting at a crystalline interface
- Tue Nguyen
- Paul S. Ho
- et al.
- 1992
- Physical Review B
Thermal stress-induced and electromigration-induced void-open failures in Al and Al-Cu fine lines
- T. Kwok
- K.K. Chan
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Observation of local melting in an aluminum bicrystal by molecular dynamics simulation
- Paul S. Ho
- Thomas Kwok
- et al.
- 1985
- Scripta Metallurgica
Computer simulation of vacancy migration in a fcc tilt boundary
- Thomas Kwok
- Paul S. Ho
- et al.
- 1984
- Surface Science
Molecular-dynamics studies of grain-boundary diffusion. II. Vacancy migration, diffusion mechanism, and kinetics
- Thomas Kwok
- Paul S. Ho
- et al.
- 1984
- Physical Review B
Molecular-dynamics studies of grain-boundary diffusion. I. Structural properties and mobility of point defects
- Thomas Kwok
- Paul S. Ho
- et al.
- 1984
- Physical Review B
Summary Abstract: Electromigration studies of al-intermetallic structures
- T. Kwok
- P.S. Ho
- et al.
- 1984
- JVSTA
Determination of vacancy mechanism for grain boundary self-diffusion by computer simulation
- R.W. Balluffi
- Thomas Kwok
- et al.
- 1981
- Scripta Metallurgica