Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI
- A. Grill
- V.V. Patel
- et al.
- 1996
- MRS Fall Meeting 1996
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36 results for Jurij Paraszczak
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
High performance dielectrics and processes for ULSI interconnection technologies
- J. Paraszczak
- D. Edelstein
- et al.
- 1993
- IEDM 1993
Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Silylation of (photo)resist materials using polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1989
- ACS National Meeting 1989
Chemistry of hexamethylcyclotrisilazane (HMCTS) silylation
- K.J. Stewart
- J.M. Shaw
- et al.
- 1989
- Symposium on Patterning Science and Technology 1989
Chemical and physical aspects of multilayer resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1989
- Proceedings of SPIE 1989
POLYSILOXANE RESIST AS A PROBE FOR ENERGY DEPOSITED IN ELECTRON BEAM EXPOSED RESISTS.
- D. Kern
- J. Paraszczak
- et al.
- 1982
- Microcircuit Engineering 1982
Multilayer resist systems using polysiloxanes as etch masks
- J. Paraszczak
- J.M. Shaw
- et al.
- 1983
- Microlithography 1983
Poly(4‐chlorostyrene), a new high contrast negative E‐beam resist
- J. Liutkus
- M. Hatzakis
- et al.
- 2004
- Polymer Engineering & Science