The development of grain structure during growth of metallic films
- C.R.M. Grovenor
- H.T.G. Hentzell
- et al.
- 1984
- Acta Metallurgica
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18 results for H.T.G. Hentzell
Grain structure variation with temperature for evaporated metal films
- H.T.G. Hentzell
- C.R.M. Grovenor
- et al.
- 1984
- JVSTA
Interdiffusion in copper-aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formation
- H.T.G. Hentzell
- K.N. Tu
- 1983
- Journal of Applied Physics
Quantitative ion beam process for the deposition of compound thin films
- J.M.E. Harper
- J.J. Cuomo
- et al.
- 1983
- Applied Physics Letters
Interdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation
- H.T.G. Hentzell
- R.D. Thompson
- et al.
- 1983
- Journal of Applied Physics
Grain size and growth of Ni-Rich Ni-Al alloy films
- H.T.G. Hentzell
- B. Andersson
- et al.
- 1983
- Acta Metallurgica
Summary Abstract: Crystallographic structure of coevaporated Ni-Al alloy films
- H.T.G. Hentzell
- B. Andersson
- et al.
- 1983
- JVSTA
Motion of W marker during sequential compound formation in bimetallic AlCu thin films
- H.T.G. Hentzell
- R.D. Thompson
- et al.
- 1983
- Materials Letters