Interaction Between ti and SiO2
- C.-Y. Ting
- M. Wittmer
- et al.
- 2019
- JES
Publications
Date
Featured collections
Popular topics
16 results for S.B. Brodsky
A Novel Borderless Contact/Interconnect Technology Using Aluminum Oxide Etch Stop for High Performance SRAM and Logic
- S. Subbanna
- D.L. Harame
- et al.
- 1993
- IEDM 1993
Diffusion barrier properties of TiN films for submicron silicon bipolar technologies
- E. Kobeda
- J. Warnock
- et al.
- 1992
- Journal of Applied Physics
A high performance low temperature 0.3 μm CMOS on SIMOX
- G. Shahidi
- B. Bucclot
- et al.
- 1992
- VLSI Technology 1992
A 5Gb/s 16×16 Si-bipolar crosspoint switch
- Hyun Shin
- James Warnock
- et al.
- 1992
- ISSCC 1992
Collimated sputtering of TiN/Ti liners into sub-half-micrometer high aspect ratio contacts/lines
- R.V. Joshi
- S.B. Brodsky
- 1992
- Applied Physics Letters
Sub-μm, planarized, Nb-AlOx-Nb Josephson process for 125 mm wafers developed in partnership with Si technology
- M.B. Ketchen
- D.J. Pearson
- et al.
- 1991
- Applied Physics Letters
Sputtered tungsten for deep submicroncomplementary metal-oxide-semiconductor technology
- L. Dori
- A.C. Megdanis
- et al.
- 1990
- Thin Solid Films
Novel self-aligned W/TiN/TiSi2 contact structure for very shallow junctions and interconnections
- R.V. Joshi
- D. Moy
- et al.
- 1989
- Applied Physics Letters
Low-resistance submicron CVD W interlevel via plugs on Al-Cu-Si
- R.V. Joshi
- S.B. Brodsky
- et al.
- 1989
- VMIC 1989