Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
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38 results for P.C. Andricacos
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Sub-micron platinum electrodes by through-mask plating
- K.L. Saenger
- G. Costrini
- et al.
- 2000
- ECS Meeting 2000
Electrodes and barriers for dram and feram: Processing, integration, and fundamentals
- K.L. Saenger
- P.C. Andricacos
- et al.
- 2001
- MRS Online Proceedings Library
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998
The application of electrodeposition processes to advanced package fabrication
- S. Krongelb
- J. Dukovic
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Electrodeposition of soft CoFe alloys
- J.W. Chang
- P.C. Andricacos
- et al.
- 1989
- ECS Meeting 1989