Electrochemical planarization of interconnect metallization
- Alan C. West
- Hariklia Deligianni
- et al.
- 2005
- IBM J. Res. Dev
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38 results for P.C. Andricacos
Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2003
- Journal of Microlithography, Microfabrication and Microsystems
Fabrication challenges for next generation devices: MEMS for RF wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering
Submicrometer Platinum Electrodes by Through-Mask Plating
- K.L. Saenger
- G. Costrini
- et al.
- 2001
- JES
Copper on-chip interconnections: A breakthrough in electrodeposition to make better chips
- Panos C. Andricacos
- 1999
- Electrochemical Society Interface
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Hot topics in electrodeposition
- Andrew A. Gewirth
- Panos C. Andricacos
- et al.
- 1998
- Electrochemical Society Interface
Future directions in electroplated materials for thin-film recording heads
- P.C. Andricacos
- N. Robertson
- 1998
- IBM J. Res. Dev
Damascene copper electroplating for chip interconnections
- P.C. Andricacos
- C. Uzoh
- et al.
- 1998
- IBM J. Res. Dev
Composition Determination of NiCo Alloys by the RRDE Method
- P.C. Andricacos
- 1995
- JES