Using simulation to analyze integrated tool performance in semiconductor manufacturingJohn MauerRoland Schelasin1994Microelectronic Engineering
Analysis of cluster tool performance in semiconductor manufacturingJohn L. MauerRoland E. A. Schelasinet al.1992IEMT 1992
A new planarization technique, using a combination of RIE and chemical mechanical polish (CMP)B. DavariC. Koburgeret al.1989IEDM 1989
Variable-size shallow trench isolation (STI) technology with diffused sidewall doping for submicron CMOSB. DavariC. Koburgeret al.1988IEDM 1988
An Advanced High-Performance Trench-Isolated Self-Aligned Bipolar TechnologyG.P. LiTak H. Ninget al.1987IEEE T-ED