Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- D. Edelstein
- J. Heidenreich
- et al.
- 1997
- IEDM 1997
Publications
Date
Featured collections
Popular topics
15 results for Charles W. Tobias
Morphology of electrodeposited Cu on 300 mm PEALD Ru substrates
- J. Kelly
- T. Vo
- et al.
- 2008
- ECS Meeting 2008
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998
The application of electrodeposition processes to advanced package fabrication
- S. Krongelb
- J. Dukovic
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
The Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas-Evolving Electrodes
- Charles W. Tobias
- 2019
- JES
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- P.C. Andricacos
- C. Arana
- et al.
- 2019
- JES
Simulation of Leveling in Electrodeposition
- John O. Dukovic
- Charles W. Tobias
- 2019
- JES
Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes
- S. Mehdizadeh
- J. Dukovic
- et al.
- 2019
- JES
Pit Growth in Nife Thin Films
- B.M. Rush
- J. Dukovic
- et al.
- 2019
- JES
The electrodeposition division: Full of surprises
- John Dukovic
- 1999
- Electrochemical Society Interface